Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Portion of housing of specific materials
Patent
1997-08-21
2000-04-04
Saadat, Mahshid
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Portion of housing of specific materials
257642, 257702, 438 99, 438612, H01L 2306, H01L 2358, H01L 2314
Patent
active
06046500&
ABSTRACT:
A method for preparing a circuitized organic substrate for the subsequent deposition of an adhesive thereon is provided. The method comprises exposing the circuitized substrate to a plasma formed from a gas mixture comprising a fluorine-containing entity. Preferably, the gas mixture used to form the plasma also comprises oxygen. It has been determined that treatment of the circuitized substrate with a plasma formed from a gas mixture comprising at least 20% by volume of the fluorine-containing entity and, preferably, up to about 80% by volume of oxygen reduces the spread of an adhesive deposited on the surface of the organic substrate. It has also been determined that such treatment does not adversely affect the subsequent bonding of wires to the wire bond sites that are present on the surface of the substrate.
REFERENCES:
patent: 4579623 (1986-04-01), Suzuki et al.
patent: 4615763 (1986-10-01), Gelorme et al.
patent: 4681654 (1987-07-01), Clementi et al.
patent: 4908094 (1990-03-01), Jones et al.
patent: 5039569 (1991-08-01), Jones et al.
patent: 5143748 (1992-09-01), Ishikawa et al.
patent: 5194579 (1993-03-01), Numata et al.
patent: 5208067 (1993-05-01), Jones et al.
patent: 5262674 (1993-11-01), Banerji et al.
patent: 5281853 (1994-01-01), Hazaki et al.
patent: 5283119 (1994-02-01), Shuttleworth et al.
patent: 5446315 (1995-08-01), Hazaki et al.
patent: 5487810 (1996-01-01), Thurm et al.
patent: 5492863 (1996-02-01), Higgins, III
patent: 5627404 (1997-05-01), Takenouchi et al.
patent: 5684325 (1997-11-01), Kataoka et al.
patent: 5756380 (1998-05-01), Berg et al.
U.S. Statutory Invention Registration No. H1164 published Apr. 6, 1993, to Wade, Jr., et al.
Fey Edmond Otto
Lyjak Kenneth Stanley
Trevitt Donna Jean
Hogg William N.
International Business Machines - Corporation
Saadat Mahshid
Wilson Allan R.
LandOfFree
Method of controlling the spread of an adhesive on a circuitized does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of controlling the spread of an adhesive on a circuitized, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of controlling the spread of an adhesive on a circuitized will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-367620