Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate
2011-03-29
2011-03-29
Picardat, Kevin M (Department: 2822)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Encapsulating
C438S112000, C438S124000, C438S125000
Reexamination Certificate
active
07915091
ABSTRACT:
A method of jetting drops of encapsulant from an encapsulant jetter, the drops including primary drops and satellite drops that are much smaller than the primary drops. The method has the steps of providing a series of wire bonds electrically connecting a micro-electronic device to a series of conductors, jetting the drops of encapsulant from the jetter and, inducing a gas flow with a velocity sufficient to draw the satellite drops in a predetermined direction away from the series of wire bonds while having negligible effect on the primary drops.
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Chew Nadine Lee-Yen
Perez Elmer Dimaculangan
Tankongchumruskul Kiangkai
Picardat Kevin M
Silverbrook Research Pty Ltd
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