Method of controlling printed circuit board solder fillets and p

Details Method of controlling printed circuit board solder fillets and p Method of controlling printed circuit board solder fillets and p

1983-12-22

1986-08-12

Kucia, R. R.

Electricity: electrical systems and devices

Miscellaneous

361406, H05K 118

Patent

active

046059873

ABSTRACT:
A solder fillet control pattern provides a predictable solder quality control for the components mounted on printed circuit boards. The pattern can include a plurality of solder fillet control boxes, which define the individual component locations. The pattern allows for a greatly increased component packing density on the boards without increasing soldering defects.

REFERENCES:
patent: 3214827 (1965-11-01), Phohofsky
patent: 3610811 (1971-10-01), O'Keefe
patent: 3887760 (1975-06-01), Krieger et al.
patent: 4139881 (1979-02-01), Shimizu et al.
patent: 4164778 (1979-08-01), Sawairi et al.
patent: 4339785 (1982-07-01), Ohsawa
patent: 4372475 (1983-02-01), Goforth
patent: 4373655 (1983-02-01), McKenzie, Jr.
patent: 4413309 (1983-11-01), Takahashi et al.
R. W. Noth, Solder Bond, IBM Tech. Disc. Bull., V. 17 #8, Jan. 1975 p. 2214.

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