Method of controlling orthophosphite ion concentration in hyphop

Compositions: coating or plastic – Coating or plastic compositions – Metal-depositing composition or substrate-sensitizing...

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106 126, 106 127, C23C 1836, C23C 1838

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active

052213285

ABSTRACT:
This invention relates to a method of controlling orthophosphite ion concentration in a hypophosphite-based electroless metal plating bath, comprising the steps of contacting the plating bath with a yttrium or a lanthanide series metal salt, and removing orthophosphite ions from the bath. The methods of the present invention provide effective means for controlling phosphite ion concentration in electroless metal plating baths and especially electroless nickel plating baths. The methods of the present invention provide means for increasing pH and removing orthophosphite ions from the plating bath.

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patent: 4717421 (1988-01-01), Frisby
Derwent Abstract 86-192773/30, Jun. 1986.
The Systems Y.sub.2 O.sub.3 --P.sub.2 O.sub.5 and Gd.sub.2 O.sub.3 --P.sub.2 O.sub.5, J. Electrochem Soc.: Solid-State and Technology, Jul. 1980, pp. 1550-1554.

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