Method of controlling misfit dislocation

Fishing – trapping – and vermin destroying

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148DIG97, 148DIG127, 437 12, 437 19, 437 81, 437939, 437946, 437976, 437977, H01L 2120, H01L 21322

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053957709

ABSTRACT:
A method of controlling a misfit dislocation in a process of producing an epitaxial semiconductor wafer comprising a semiconductor substrate and an epitaxial layer deposited on the semiconductor substrate, an impurity concentration of the epitaxial layer differing from that of the semiconductor substrate, has the step of controlling the amount of an extrinsic strain caused on the back surface of the semiconductor substrate prior to the step of depositing the epitaxial layer, thereby controlling an occurrence of misfit dislocation caused in and near the interface between the semiconductor substrate and the epitaxial layer.

REFERENCES:
patent: 3923567 (1975-12-01), Lawrence
patent: 4131487 (1978-12-01), Pearce et al.
patent: 4257827 (1981-03-01), Schwattke et al.
patent: 4276114 (1981-06-01), Takano et al.
patent: 4376657 (1983-03-01), Nagasawa et al.
patent: 4525239 (1985-06-01), Wang
patent: 4659400 (1987-04-01), Garbis et al.
patent: 4782029 (1988-11-01), Takemura et al.
patent: 4878988 (1989-11-01), Hall et al.
patent: 5130260 (1992-07-01), Suga et al.
Wolf et al., Silicon Processing for the VLSI Era, vol. 1: Process Technology, Lattice Press, 1986, pp. 136-139.
Hull et al, "Variation in Misfit Dislocation Behavior as a Function of Strain in Strain in the GeSi/Si System", Applied Physics Letters, vol. 54, No. 10, Apr. 6, 1989, pp. 925-927.
"Semiconductor Wafer Process Contamination Gettering", IBM Technical Disclosure Bulletin, vol. 29, No. 4, Sep., 1986, p. 1561.
H. Kikuchi et al, "New Gettering Using Misfit Dislocations in Homoepitaxial Wafers With Heavily Boron-Doped Silicon Substrates", Applied Physics Letters, vol. 54, No. 5, Jan., 1989, pp. 463-465.
A. Salih et al, "Grated Diode Leakage and Lifetime Measurements of Misfit Dislocation Gettered Si Epitaxy", Applied Physics Letters, vol. 50, No. 23, Jun. 8, 1987, pp. 1678-1680.
D. Beauchaine et al, "Effect of Thin Film Stress and Oxygen Precipitation on Warpage Behavior of Large Diameter P/P+ Epitaxial Wafers", Journal of the Electrochemical Society, vol. 136, No. 6, Jun., 1989, pp. 1787-1793.

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