Method of controlling epoxy resin etchant ion concentration

Details Method of controlling epoxy resin etchant ion concentration Method of controlling epoxy resin etchant ion concentration

1989-07-05

1991-05-28

Valentine, Donald R.

Chemistry: electrical and wave energy

Processes and products

Electrostatic field or electrical discharge

20415315, 20415316, 156627, 156642, 156644, 156668, 156902, C25F 500, C25F 702, B44C 122, B44C 1500

Patent

active

050192299

ABSTRACT:
A method of and an apparatus for etching an epoxy resin having a high backetching rate, in particular bores with printed circuit boards, with stable, strong, basic alkaline permanganate etching solution wherein the solution is stablized by electrochemical anodal oxidation, and permanganate and OH-ion concentration is controlled by measuring the same by using electrochemical and/or photometric measuring method with subsequent metering of the solution in accordance with deviation of a measurement value from a nominal value.

REFERENCES:
patent: 2782151 (1957-02-01), Suthard
patent: 3547785 (1970-12-01), Sakuma
patent: 3874959 (1975-04-01), Hoekstra
patent: 4036704 (1977-07-01), Takata
patent: 4468305 (1984-08-01), Hillis
patent: 4756930 (1988-07-01), Kukanskis et al.
patent: 4853095 (1989-08-01), D'Ambrisi
patent: 4859300 (1989-08-01), Sullivan et al.
patent: 4948630 (1990-08-01), Courduvelis et al.

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