Method of controlling deposition amount distribution in a vacuum

Details Method of controlling deposition amount distribution in a vacuum Method of controlling deposition amount distribution in a vacuum

1985-06-03

1986-09-16

Childs, Sadie L.

Coating processes

Measuring, testing, or indicating

Thickness or uniformity of thickness determined

118692, 118718, 118726, 427250, 4272555, C23C 1600, C23C 1606

Patent

active

046122060

ABSTRACT:
In a continuous vacuum deposition plating of a metal strip, thinner coating at the edges can be prevented by maintaining the pressure of the deposition chamber in which an evaporation chamber is housed at a properly higher level than the pressure of the evaporation chamber.

REFERENCES:
patent: 3040702 (1962-06-01), Eng et al.
patent: 3854442 (1974-12-01), Adam et al.
patent: 4051270 (1977-09-01), Butler
patent: 4526802 (1985-07-01), Sato

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