Method of controlling component concentration of plating solutio

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Involving measuring – analyzing – or testing

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205101, C25D 2114

Patent

active

058581960

ABSTRACT:
The present invention provides a method of controlling a component concentration of a plating solution in continuously electroplating a metallic strip while controlling a metal ion concentration of the plating solution. In the control method, when a total amount of the plating solution flowing in the series of devices varies from a preselected target value of the total bath amount, a feedback control target value of the metal ion concentration is controlled by changing it to a corrected target value of the metal ion concentration computed on the basis of a preselected target value of the metal ion concentration and said variation in the total amount of the plating solution so that the acid concentration or pH of the plating solution is kept constant. This method is capable of continuously electroplating a metallic strip with high efficiency and high precision.

REFERENCES:
patent: 5368715 (1994-11-01), Hurley et al.
patent: 5368716 (1994-11-01), Kikuta

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