Method of controlling adhesion of fine particles to an object in

Cleaning and liquid contact with solids – Processes – Hollow work – internal surface treatment

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134 2219, 134902, 437946, 148DIG17, B08B 900

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active

054095441

ABSTRACT:
A method of controlling the adhesion of fine particles to an object in a solution characterized in that the adhesion of fine particles in the solution is prevented or reduced by adding into the solution a material, which is capable of controlling the zeta potential (surface potential) of the fine particles, in the amount of 10.sup.-7 to 25% by volume.

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RCA Review, Jun. 1970, Werner Kern, et al. "Cleaning solutions based on hydrogen peroxide for use in silicon semi-conductor Technology".
Saito et al "Particle Deposition Mechanism Onto Si Wafer" in Extended Abstracts for the 21st Conference on Solid State Devices and Materials, Aug. 28-30, 1989, pp. 409-412.
Saito et al "Particle Deposition Mechanism Onto Si Wafer" in Microcontamination Conference Proceedings, Oct. 16-18, 1991, pp. 562-569.
Saito et al "Novel Method For Prevention of Particle Deposition in Wet LSI Processes" Electrochemical Society Extended Abstracts vol. 19-1, May 5-10, 1991, pp. 571-572 and pp. 749-754.

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