Method of contacting contact points of a semiconductor body

Details Method of contacting contact points of a semiconductor body Method of contacting contact points of a semiconductor body

1974-03-22

1976-07-06

Tupman, W.

Metal working

Method of mechanical manufacture

Assembling or joining

29576S, 29591, 228180A, B01J 1700

Patent

active

039673669

ABSTRACT:
A method of contacting contact points of a semiconductor body comprises first attaching the semicoductor body to a heat conducting portion of a first frame with inwardly directed tongues directed towards the contact points, positioning a second frame with inwardly directed tongues engaging with their ends, the contact points, the second frame also engaging the first frame, attaching the frames and semiconductor body together at the engagement points and thereafter separating each of the two frames to provide insulated leads to the contact points.

REFERENCES:
patent: 3387359 (1968-06-01), Dale
patent: 3436810 (1969-04-01), Kauffman
patent: 3544857 (1970-12-01), Byrne
patent: 3553828 (1971-01-01), Starger
patent: 3698074 (1972-10-01), Helda
patent: 3762039 (1973-10-01), Douglass

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