Metal working – Method of mechanical manufacture – Electrical device making
Patent
1995-06-06
1996-10-22
Schwartz, Larry I.
Metal working
Method of mechanical manufacture
Electrical device making
29832, 29852, H05K 334
Patent
active
055664482
ABSTRACT:
A method of forming an I/C chip mounting module, and for mounting an I/C chip thereon, is disclosed. A rigid cap and substrate are provided. A bottomed cavity is routed in the cap, and the substrate has circuitry formed thereon. The cap and substrate are laminated together with bond pads, which connect to the circuitry being disposed in the cavity. After circuitization of the exposed surface of the cap and drilling and plating of vias, the material of the cap overlying the cavity is removed to expose the bond pads. Thereafter, an I/C chip is connect to the pads.
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"IBM Technical Disclosure Bulletin," vol. 27, No. 2, Jul., 1984, p. 1139.
Bhatt Ashwinkumar C.
Duffy Thomas P.
Knight Jeffrey A.
Walsh James P.
Coley Adrian
International Business Machines - Corporation
Schwartz Larry I.
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