Method of constructing high yield, fine line, multilayer printed

Details Method of constructing high yield, fine line, multilayer printed Method of constructing high yield, fine line, multilayer printed

1994-04-04

1996-06-25

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

29831, 2940208, 174250, H05K 336

Patent

active

055288260

ABSTRACT:
In the handling of printed wiring board innerlayer panels which have a thin copper-clad substrate, the protective foil layer is retained thereon to aid in stiffening the panel during processing up to the final stacking for multilayer lamination. At an intermediate step, the circuit patterns are inspected and defective patterns are replaced by operative patterns during the stacking process prior to multilayer lamination.

REFERENCES:
patent: 4338149 (1982-07-01), Quaschner
patent: 4820171 (1989-04-01), Korteqaard
patent: 4961806 (1990-10-01), Gerrie et al.
patent: 5321884 (1994-06-01), Ameen et al.

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