Method of constructing a structural circuit

Details Method of constructing a structural circuit Method of constructing a structural circuit

2004-11-12

2008-03-18

Phan, Tim (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S831000, C029S832000, C029S842000, C156S234000, C156S238000, C156S247000, C156S345420, C257SE21499, C257SE23181, C428S001100, C428S001200

Reexamination Certificate

active

07343675

ABSTRACT:
A method relating to a multi-functional, structural circuit, referred to as a structural circuit, is disclosed. The method can include thermoforming a liquid crystal polymer (LCP) circuit with a structural element (215). At least one circuit component can be attached to the surface of the LCP circuit (220).

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Hayden, Terry F., Dr., “New Liquid Crystal Polymer (LCP) Flex Circuits to Meet Demanding Reliability and End-Use Applications Requirements” 3M Microelectronics Systems Division, Austin, TX.
Yang, Rui. “A flex circuit substrate option”. [online] [retrieved on Jul. 27, 2004]. Retrieved from the Internet:<URL:http//ap.pennent.com/Articles/Article—Display.cfm?Section=Articles&Subsection=Displa . . . .
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Hayden, T., “New Liquid Crystal Polymer (LCD) Flex Circuits to Meet Demanding Reliability and End-Use Applications Requirements” 3M Microelectronics Systems Division, Austin, TX. Presented at the International Conference on Advanced Packaging and Systems, Mar. 2002.

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