Method of constructing a stacked-die semiconductor structure

Details Method of constructing a stacked-die semiconductor structure Method of constructing a stacked-die semiconductor structure

2011-03-08

2011-03-08

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

C438S108000, C257S777000, C257SE25030, C257SE21513, C257SE21523

Reexamination Certificate

active

07901955

ABSTRACT:
In constructing a multi-die semiconductor device, a plurality of semiconductor die are provided. Each die is probe tested when it is part of a wafer. Flat contacts are connected to each die when it is part of a wafer. After wafer sawing, each die is tested in a test socket, using the contacts connected thereto. The die are then packaged in stacked relation to form the multi-die semiconductor device.

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