Method of connecting terminals of a plastic-encapsulated power t

Fishing – trapping – and vermin destroying

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437216, 361731, 361740, 361732, 361764, 361783, 361809, 439810, H01L 2148, H01L 2158, H01L 21603, H05K 720

Patent

active

054707951

ABSTRACT:
Disclosed is a method of connecting the terminals of at least one heat-sinked, plastic-encapsulated power transistor to circuits of a printed-circuit board. In the method, a main flat surface of the plastic-encapsulated power transistor is adhered to a first side of a heat sink. The transistor has a plurality of terminals projecting from one end of a transistor body in an orientation generally parallel to the main flat surface of the transistor. On a printed-circuit board, a mechanical coupling device is mounted that has respective conductors with respective, terminal-receiving apertures, for receiving the terminals of the transistor. The conductors are connected to respective circuits of the printed-circuit board. The printed-circuit board is adapted to be located on the mentioned one side of the heat sink in an assembled position. The heat sink, with the transistor mounted thereon, is positioned such that the terminals are respectively inserted into respective apertures in the mechanical coupling device. In any order, (i) the heat sink is affixed to a support member positioned in fixed relation to the printed-circuit board; and (ii) the terminals are mechanically secured in the apertures of the mechanical coupling device, and, in doing so, the respective tensioning devices are moved from a non-pressing, to a sufficiently pressing, relation against the terminals that so-pressed portions of the terminals become substantially deformed in a manner that lowers ohmic contact resistance between the terminals and the conductors of the mechanical coupling means.

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