Method of connecting TAB tape to semiconductor chip, and bump sh

Fishing – trapping – and vermin destroying

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Details

437206, 437182, 437183, 2281802, H01L 2348

Patent

active

051643367

ABSTRACT:
A method of connecting a TAB tape to a semiconductor chip is disclosed which comprises the steps of preliminarily locating and fixing bumps at positions corresponding to a pattern of electrodes of the semiconductor chip to be connected; and bonding the bumps by thermocompression to the electrodes of the semiconductor chip and the leads of the TAB tape, respectively, so that each electrode of the semiconductor chip is electrically connected to the corresponding lead of the TAB tape through a corresponding one of the bumps. Also disclosed are a bump sheet and a bumped tape to be used in a method of connecting a TAB tape to a semiconductor chip.

REFERENCES:
patent: 4784972 (1988-11-01), Hatada

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