Method of connecting module layers suitable for the...

Details Method of connecting module layers suitable for the... Method of connecting module layers suitable for the...

2008-06-03

2008-06-03

Stoner, Kiley (Department: 1793)

Metal fusion bonding

Process

Diffusion type

C228S206000, C228S254000

Reexamination Certificate

active

07380698

ABSTRACT:
A method for joining microstructured component layers and a method for manufacturing microstructure component layers and the microstructure component layer is provided. At least one multifunctional barrier coating is applied to the joining surfaces of a base material layer for the microstructured component layers. The layers are made of aluminum/aluminum alloys and/or copper/copper alloys, and/or noble steels. At least one solder/brazing coating is applied to each barrier coating. The coated base material layers comprising the component layers are stacked. The stacked component layers are joined by solder/brazing using heat. The melting temperature of the solder/brazing coating is higher after the heat joining than before same.

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Chemanager, Haben Ruhrkessel Ausgedient, May 2002.
International Search Report of International Application PCT/DE01/01570.

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