Method of connecting metal leads with electrodes of semiconducto

Details Method of connecting metal leads with electrodes of semiconducto Method of connecting metal leads with electrodes of semiconducto

1982-03-11

1985-01-22

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

228188, B23K 1900

Patent

active

044946880

ABSTRACT:
A method suitable for connecting a plurality of metal leads at the same time with electrodes of a semiconductor device. Metal leads are provided each of which has a metal bump bonded thereto. The metal of the metal bump is softer than that of the lead. Those metal leads are located above the semiconductor device so that the bumps are contacted with the electrodes and then the bumps are bonded to the electrodes by heating, whereby the metal leads are connected with the electrodes.

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