Method of connecting electrodes

Details Method of connecting electrodes Method of connecting electrodes

1990-05-17

1991-05-07

Heinrich, Sam

Metal fusion bonding

Process

With measuring, testing, indicating, inspecting, or...

2281802, H05K 332

Patent

active

050129694

ABSTRACT:
A face-down connecting an electrode formed on a semiconductor device surface and an electrode on a circuit substrate using an insulating resin, is arranged such that after positioning the electrode of the circuit substrate and the electrode of the semiconductor device, they are pressed from the side of semiconductor device or circuit substrate, and, in this state, a light-stiffening insulating resin is applied to the side surface of the semiconductor device, and then the light-stiffening insulating resin is stiffened. Since the light-stiffening insulating resin is applied and injected between the semiconductor device and circuit substrate with the electrodes of the semiconductor device and circuit substrate pressed together, the light-stiffening insulating resin intervenes between the two electrodes, and the problems of failure of the electrical contact between the two electrodes or a high electrical connection resistance will be avoided. Besides, since the electrodes of the semiconductor device and circuit substrate are positioned before injecting the resin, it is possible to identify the electrodes more easily than when positioning after applying the resin, so that positioning of a higher precision may be effected in a shorter time as compared with prior art methods.

REFERENCES:
patent: 4441248 (1984-04-01), Sherman et al.
patent: 4604644 (1986-08-01), Beckham et al.
patent: 4749120 (1988-06-01), Hatada
Patent Abstracts of Japan, vol. 12, No. 174 (E-612)[3021], May 24, 1988; JP-A-62-281360, Dec. 7, 1987, Kawakita, Matsushita Electric Industrial Co., Ltd.
Patent Abstracts of Japan, vol. 10, No. 133 (E-404)[2190], May 17, 1986; JP-A-60-262430, Dec. 25, 1985, Hatada, Matsushita Denki Sangyo K.K.

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