Method of connecting a unit under test in a wireless test fixtur

Details Method of connecting a unit under test in a wireless test fixtur Method of connecting a unit under test in a wireless test fixtur

1997-11-12

2000-04-11

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29852, 324754, H05K 336

Patent

active

060474696

ABSTRACT:
A multilayer printed circuit board has prefabricated inner signal layers and unfinished top and bottom layers for customizing the board for a particular test installation. Each signal layer has a predetermined arrangement of circuits, each circuit having first and second via pads at opposite ends of the circuit. The first via pads form a virtual grid for selective connection to test points of a unit under test. The top layer is processed to provide a test pad aligned with each test point on a unit under test, a via pad for each test pad which is aligned with the closest available virtual grid via, and a connecting trace between each test pad and the associated via pad. Plated through holes are drilled through the board at each outer layer via pad for connection to the aligned virtual grid via. Similar processing of the bottom layer connects the via pad at the opposite end of each assigned inner layer circuit to an interface pad for connection to a respective terminal of automated test equipment.

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