Method of connecting a lead of a mounting part with a land of a

Details Method of connecting a lead of a mounting part with a land of a Method of connecting a lead of a mounting part with a land of a

1992-10-16

1993-12-07

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174260, 361777, H05K 100

Patent

active

052685365

ABSTRACT:
A coating pattern is used for coating a conductive adhesive on a plurality of lands of a circuit substrate. According to the pattern, one land is coated with the conductive adhesive on the area corresponding to a tip of a downwardly inclined lead. An adjacent land is coated with the conductive adhesive except on the area corresponding to the tip of the lead. The pattern alternates on adjacent lands. Therefore, when the leads are connected with the lands of the circuit substrate, the conductive adhesive which is expanded in the vicinity of the tip of the lead does not come in contact with the conductive adhesive of an adjacent land.

REFERENCES:
patent: 4796078 (1989-01-01), Phelps, Jr. et al.
patent: 4818823 (1989-04-01), Bradley
patent: 5175612 (1992-12-01), Long et al.

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