Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-08-09
2005-08-09
Cuneo, Kamand (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S776000, C029S850000
Reexamination Certificate
active
06927982
ABSTRACT:
In a method of connecting a device to a support, in which method the device comprises at least a first terminal region, and in which method the support comprises at least a second terminal region, electrically conductive, flexible microparticles are initially produced on the first terminal region and/or on the second terminal region. Subsequently the terminal regions are connected via the electrically conductive, flexible microparticles.
REFERENCES:
patent: 5818700 (1998-10-01), Purinton
patent: 5994766 (1999-11-01), Shenoy et al.
patent: 6025647 (2000-02-01), Shenoy et al.
patent: 6166444 (2000-12-01), Hsuan et al.
patent: 6225143 (2001-05-01), Rao et al.
patent: 6250984 (2001-06-01), Jin et al.
patent: 6277318 (2001-08-01), Bower et al.
patent: 6346189 (2002-02-01), Dai et al.
patent: 6536106 (2003-03-01), Jackson et al.
patent: 44 24 753 (1996-01-01), None
patent: 1 096 533 (2001-05-01), None
patent: WO 00/30141 (2000-05-01), None
patent: WO 01/61753 (2001-08-01), None
No affiliations
Dinh Tuan
Greenberg Laurence A.
Infineon - Technologies AG
Locher Ralph E.
Stemer Werner H.
LandOfFree
Method of connecting a device to a support, and pad for... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of connecting a device to a support, and pad for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of connecting a device to a support, and pad for... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3518766