Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2007-09-04
2007-09-04
Huynh, Andy (Department: 2818)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S612000, C438S618000
Reexamination Certificate
active
10292273
ABSTRACT:
A method of connecting a conductive trace to a semiconductor chip includes providing a semiconductor chip that includes a conductive pad, providing a conductive trace, then disposing a conductive adhesive between the conductive trace and the chip, thereby mechanically attaching the conductive trace to the chip such that the conductive trace overlaps the pad and the conductive adhesive contacts and is sandwiched between and electrically connects the conductive trace and the pad, and then removing a portion of the conductive adhesive such that the conductive adhesive still contacts and is sandwiched between and electrically connects the conductive trace and the pad and the conductive adhesive no longer electrically connects the conductive trace to a conductor external to the chip.
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Bridge Semiconductor Corporation
Goodwin David
Huynh Andy
Sigmund David M.
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