Method of conforming an adherent film to a substrate by...

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C156S087000, C156S286000, C052S746100

Reexamination Certificate

active

06872268

ABSTRACT:
Films are closely conformed to substrates by reducing the air pressure to a subatmospheric level in at least one airflow pathway that is present in the film or the substrate. The reduced air pressure enables the film to tightly contact the substrate in locations where protrusions or depressions on the substrate are present. The method is particularly useful for conforming film containing graphics to a variety of substrates such as the sides of semi-trailers or concrete block walls, even in instances where the semi-trailer sides include rivets and/or grooves and where the concrete block wall is relatively rough.

REFERENCES:
patent: 1498618 (1924-06-01), Fritz
patent: 2983305 (1961-05-01), Scher et al.
patent: 3900362 (1975-08-01), Schaffer
patent: 4049479 (1977-09-01), Siker
patent: 4166152 (1979-08-01), Baker et al.
patent: 4412876 (1983-11-01), Lerner et al.
patent: 4489119 (1984-12-01), Ishige et al.
patent: 4532174 (1985-07-01), Freller et al.
patent: 4640735 (1987-02-01), Murray et al.
patent: 4670089 (1987-06-01), Hanson
patent: 4751121 (1988-06-01), Kuhnel et al.
patent: 4867816 (1989-09-01), Suiter
patent: 4894060 (1990-01-01), Nestegard
patent: 4944514 (1990-07-01), Suiter
patent: 4968562 (1990-11-01), Delgado
patent: 5106439 (1992-04-01), Wellings et al.
patent: 5296277 (1994-03-01), Wilson et al.
patent: 5425977 (1995-06-01), Hopfe
patent: 5540809 (1996-07-01), Ida et al.
patent: 5667165 (1997-09-01), Gardner
patent: 5800919 (1998-09-01), Peacock et al.
patent: 6127000 (2000-10-01), Carbonell et al.
patent: 6149749 (2000-11-01), McBroom
patent: 6197397 (2001-03-01), Sher et al.
patent: 6287685 (2001-09-01), Janssen et al.
patent: 6311399 (2001-11-01), Steelman et al.
patent: 6474389 (2002-11-01), Steelman et al.
patent: 6531206 (2003-03-01), Johnston et al.
patent: 20010031353 (2001-10-01), Hannington
patent: 20020092611 (2002-07-01), Anderson et al.
patent: 20020146540 (2002-10-01), Johnston et al.
patent: 20030041961 (2003-03-01), Thunhorst et al.
patent: 20030077423 (2003-04-01), Flaningan et al.
patent: 20030150547 (2003-08-01), Kesti et al.
patent: 2 160 144 (1973-07-01), None
patent: 198 42 159 (1999-04-01), None
patent: 197 33 935 (1999-11-01), None
patent: 100 45 100 (2002-03-01), None
patent: 0 570 515 (1996-06-01), None
patent: 0 617 708 (1996-09-01), None
patent: 0 787 539 (1997-06-01), None
patent: 2 300 249 (1976-09-01), None
patent: 63059517 (1988-03-01), None
patent: 01123723 (1989-05-01), None
patent: WO 9217870 (1992-10-01), None
patent: WO 9721206 (1997-06-01), None
patent: WO 9731077 (1997-08-01), None
patent: WO 9829516 (1998-07-01), None
patent: WO 0043196 (2000-07-01), None
patent: WO 0043220 (2000-07-01), None
patent: WO 0189806 (2001-11-01), None
patent: WO 0211107 (2002-02-01), None
Satas et al,Handbook of Pressure Sensitive Adhesive Technology,2ndEd. (Van Nostrand Reinhold, N.Y., 1989).
Wente, Van A., “Superfine Thermoplastic Fibers” in Industrial Engineering Chemistry, vol.48, pp. 1342 et seq (1956).
Report No.4364 of the Naval Research Laboratories, published May 25,1954, entitled “Manufacture of Superfine Organic Fibers” by Wente,Van A.; Boone, C.D.; and Fluharty, E.L.
Ten Steps to Successful Vinyl Truck Lettering, H. Brady, Computer-Aided Sign Making, Issue 74, Jan./Feb. 1994.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of conforming an adherent film to a substrate by... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of conforming an adherent film to a substrate by..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of conforming an adherent film to a substrate by... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3455692

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.