Method of conducting plasma treatment

Details Method of conducting plasma treatment Method of conducting plasma treatment

1990-07-19

1992-01-21

Pianalto, Bernard

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

156643, 156646, 427 47, 4272551, 427294, 427307, 427444, B05D 306

Patent

active

050826859

ABSTRACT:
A treatment, typically plasma treatment apparatus comprises a plasma creating chamber adapted to create a plasma therein, a treating chamber in communication with the plasma creating chamber through an electrode for drawing electron beams from the plasma, an input conduit coupled to the treating chamber for introducing a reaction gas therein, and directive means associated with the input conduit for imparting directivity to the reaction gas. With the apparatus, plasma treatment, typically plasma CVD or plasma etching is carried out on an article in the chamber by forming a high density region of the reaction gas substantially perpendicular to the electron beams in the chamber.

REFERENCES:
patent: 4740267 (1988-04-01), Knauer et al.
Japanese Patent Abstracts of Japan, 63-83273 A, C.523, Aug. 24, 1988, vol. 12, No. 312.
Japanese Patent Abstracts of Japan, 1-17869 A, C-593, May 8, 1989, vol. 13, No. 190.
Japanese Patent Abstracts of Japan, 1-180981 A, C-646, Oct. 20, 1989, vol. 13, No. 466.

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