Method of compensating for thermal expansion in SMT...

Details Method of compensating for thermal expansion in SMT... Method of compensating for thermal expansion in SMT...

2009-01-22

2010-12-14

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S840000

Reexamination Certificate

active

07849592

ABSTRACT:
The present invention relates to a method of providing end and center locating connectors in interconnects between surface mount technology (SMT) connectors and printed circuit boards (PCBs). The connectors are adapted to maintain their connection even when the printed circuit board and/or the SMT connector expands or contracts.

REFERENCES:
patent: 5610436 (1997-03-01), Sponaugle et al.
patent: 6764325 (2004-07-01), Arrigotti et al.
patent: 7056133 (2006-06-01), Iwasaki
patent: 2003/0216066 (2003-11-01), Arrigotti et al.
patent: 2008/0141530 (2008-06-01), Beaman et al.
patent: 2008/0180900 (2008-07-01), Domitrovits et al.

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