Method of compensating for etch rate non-uniformities by ion...

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching

Reexamination Certificate

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C438S714000

Reexamination Certificate

active

07098140

ABSTRACT:
Etch uniformity is improved in that a specified material layer to be etched is exposed to an ion beam so as to implant an ion species, wherein at least one implantation parameter is varied in conformity with local etch rates of the specified material layer. In this way, etch non-uniformities, induced by tool non-uniformities and recipe specific characteristics, may be significantly reduced.

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patent: 2000188396 (2000-07-01), None

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