Method of collecting impurities on surface of semiconductor...

Details Method of collecting impurities on surface of semiconductor... Method of collecting impurities on surface of semiconductor...

2005-06-28

2005-06-28

Kornakov, Michael (Department: 1746)

Cleaning and liquid contact with solids

Processes

Including regeneration, purification, recovery or separation...

C134S013000, C134S032000, C134S033000, C134S034000, C438S906000

Reexamination Certificate

active

06911096

ABSTRACT:
A method of collecting impurities existing on the surface of a semiconductor wafer and in a thin film formed on the semiconductor wafer is provided with a process for dripping collecting liquid on the surface of the semiconductor wafer to which hydrophobic processing is applied, a process for elongating the collecting liquid dripped and turned spherical by surface tension in a direction of the radius of the semiconductor wafer with the surface tension kept, a process for relatively rolling and scanning the elongated collecting liquid, touching the collecting liquid to the surface of the semiconductor wafer and incorporating impurities into the collecting liquid, a process for restoring the elongated collecting liquid to the original spherical shape after the impurities are incorporated and a process for withdrawing the collecting liquid restored to the spherical shape from the surface of the semiconductor wafer.

REFERENCES:
patent: 05-082495 (1993-04-01), None
patent: 05-283498 (1993-10-01), None
patent: 11-142827 (1999-05-01), None

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