Method of coating facet of semiconductor optical element

Details Method of coating facet of semiconductor optical element Method of coating facet of semiconductor optical element

1990-08-01

1993-02-09

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437228, 437905, 148DIG95, 148DIG99, H01L 2120

Patent

active

051852900

ABSTRACT:
A method of selectively coating one of two spaced apart facets of respective light-emitting regions on the same surface of a semiconductor device formed in a semiconductor wafer includes forming at least one first groove in a wafer and forming at least one second groove in the wafer intersecting the first groove, exposing light-emitting region facets on a side wall surface of the second groove. A stream of an evaporated coating material is directed across an edge, formed by the intersection of a side wall surface of the second groove with the first groove, at an angle relative to the wafer surface so that the edge shadows one of the light-emitting region facets but not the other. After the coating process, the wafer is divided into individual devices that may include adjacent, differently coated light-emitting region facets. The invention avoids a mechanical mask alignment step by employing in the coating process first grooves that are self aligning relative to the light-emitting region facets.

REFERENCES:
patent: 3851379 (1974-12-01), Gutknecht et al.
patent: 4337115 (1982-06-01), Ikeda et al.
patent: 5063173 (1991-11-01), Gasser et al.
S. M. Sze, "VLSI Technology", McGraw Hill International Book Company, 1983, pp. 430-435.

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