Method of coating copper conductors on polyimide with a corrosio

Details Method of coating copper conductors on polyimide with a corrosio Method of coating copper conductors on polyimide with a corrosio

1987-06-10

1988-09-13

Beck, Shrive P.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 98, 427306, 427307, 4274431, B05D 512

Patent

active

047708999

ABSTRACT:
A module, for interconnecting integrated circuits, is comprised of a substrate, a layer of polyimide disposed thereon, and a plurality of spaced apart copper conductors on the layer of polyimide. This module is dipped into a solution of palladium chloride, thereafter it is dipped into a solution of sodium hydroxide, and thereafter it is dipped into an electroless plating solution for cobalt. As a result, a film of cobalt is deposited on all exposed surfaces of the copper conductors, but no cobalt is deposited on the exposed polyimide surface between the conductors. This cobalt film protects the copper conductors from corrosion, and it does not short the conductors together.

REFERENCES:
patent: 3753667 (1973-08-01), Metzger
patent: 3821016 (1974-06-01), De Angelo
patent: 3878007 (1975-04-01), Feldstein
patent: 4568562 (1986-02-01), Phillips
patent: 4600609 (1986-07-01), Leever
Ronald J. Jensen, John P. Cummings and Harshadrai Vora, "Copper/Polyimide Materials Systems for High Performance Packaging", IEEE Trans. Components, Hybrids and Manuf. Technology, vol. CHMT-7, No. 4, Dec. 1984, pp. 384-393.

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