Method of coating an electronic component

Details Method of coating an electronic component Method of coating an electronic component

1996-04-25

1997-12-16

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

29850, 427 58, 427 96, 437211, H05K 330, H01K 310, B05D 512

Patent

active

056971494

ABSTRACT:
A technique of coating an electronic component with a resin. A semiconductor chip is placed on an insulating film carrying electric contacts to which the semiconductor chip is connected by connection wires passing through holes formed in the insulating film. The holes in the insulating film are placed around a zone for receiving the semiconductor chip, and the semiconductor chip is placed on the insulating film in such zone. The connection wires are connected between the semiconductor chip and the electric contacts, and a drop of resin is deposited on the semiconductor chip and on the connection wires. This drop forms an outline defined solely by the holes due to surface tension applied by the resin retained in the holes. This arrangement is applicable to electronic modules for memory cards.

REFERENCES:
patent: 4674175 (1987-06-01), Stampfli
patent: 5041395 (1991-08-01), Steffen
patent: 5182853 (1993-02-01), Kobayashi et al.
patent: 5336931 (1994-08-01), Juskey et al.
Patent Abstracts of Japan, vol. 1, No. 167 (E-610), 19 May 1988, and JP-A-62 276839 (Hirachi Ltd.), 1 Dec. 1987.

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