Method of coating an aluminum compound substrate with a composit

Details Method of coating an aluminum compound substrate with a composit Method of coating an aluminum compound substrate with a composit

1992-01-23

1993-03-30

Beck, Shrive

Coating processes

Electrical product produced

Metallic compound coating

4271263, 4273763, 4273766, 427377, 4274431, 2041921, 205163, 205213, B05D 512

Patent

active

051982650

ABSTRACT:
An adherent layer comprising elemental titanium, optionally in combination with another metal such as copper, is deposited on a substrate, preferably of alumina or aluminum nitride, and serves as a base for a further conductive coating which may be applied by electroless or electrolytic deposition. The adherent layer is applied by contacting the substrate with a mixture of the elemental metal(s) and a substantially anhydrous salt composition, preferably an equimolar mixture of potassium chloride and sodium chloride; heating at a temperature and for a time sufficient to melt said salt composition; and removing said salt composition, preferably by water washing.

REFERENCES:
patent: 4159357 (1979-06-01), Grunke
patent: 4459328 (1984-07-01), Mizuhara
patent: 4532190 (1985-07-01), Kanbe et al.
patent: 4740429 (1988-04-01), Tsuno
patent: 4820562 (1989-04-01), Tanaka et al.
patent: 4980239 (1990-12-01), Harada
patent: 5023147 (1991-06-01), Nakata et al.

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