Method of clearing electrical contact pads in thin film...

Details Method of clearing electrical contact pads in thin film... Method of clearing electrical contact pads in thin film...

2005-06-27

2010-06-29

Smith, Matthew (Department: 2823)

Semiconductor device manufacturing: process

Chemical etching

Vapor phase etching

C438S082000, C438S099000, C438S780000, C257SE21523, C257SE21590

Reexamination Certificate

active

07745340

ABSTRACT:
A process of cleaning wire bond pads associated with OLED devices, including the steps of depositing on the wire bond pads one or more layers of ablatable material, and ablating the one or more layers with a laser, thereby exposing a clean wire bond pad.

REFERENCES:
patent: 5194548 (1993-03-01), Yoshimura
patent: 5904859 (1999-05-01), Degani
patent: 6587573 (2003-07-01), Stam et al.
patent: 2002/0153523 (2002-10-01), Bernius et al.
patent: 2003/0209979 (2003-11-01), Guenther et al.
patent: 2005/0248260 (2005-11-01), Sellars et al.

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