Method of cleaning test probes

Cleaning and liquid contact with solids – Processes – For metallic – siliceous – or calcareous basework – including...

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51323, 134 6, 134 26, 134 35, 134 41, B08B 308, B08B 310

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active

043148557

ABSTRACT:
Contaminants that accumulate on test probes utilized to contact aluminum pads on integrated circuit chips cause the probe resistance to become unacceptably high. As disclosed herein, the contaminants (predominantly a mixture of aluminum and aluminum oxide) are substantially removed by immersing the probes in boiling water. Adding small quantities of phosphoric and/or hydrofluoric acids to the water further improves the cleaning action.

REFERENCES:
patent: 1804331 (1931-05-01), Freund
patent: 2622046 (1952-12-01), Bassett
patent: 3448055 (1969-06-01), Mickelson et al.
patent: 3598741 (1971-08-01), Kanno
patent: 4014715 (1977-03-01), Preston
patent: 4049471 (1977-09-01), Koontz
patent: 4198262 (1980-04-01), Gay

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