Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Patent
1999-05-24
2000-09-26
Bowers, Charles
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
438477, 438759, 438770, 438974, 438906, 134 13, H01L 21322, H01L 21302, H01L 2131
Patent
active
061242101
ABSTRACT:
The present invention relates to a method of cleaning a surface of a substrate employed prior to film formation by using the CVD method which uses a reaction gas containing an ozone containing gas which contains ozone (O.sub.3) in oxygen (O.sub.2) and tetraethylorthosilicate (TEOS). The substrate surface cleaning method comprises the steps of oxidizing particles 13 by contacting a pre-process gas containing ozone 15 to a surface 12 of a substrate 11 on which the particles 13 are present, and removing the particles 13 by heating the substrate 11 to exceed a decomposition point of oxide 13a of the particles 13.
REFERENCES:
patent: 5674357 (1997-10-01), Sun et al.
patent: 5749975 (1998-05-01), Li et al.
patent: 5782986 (1998-07-01), Butterbaugh et al.
patent: 5994240 (1999-11-01), Thakur
Chino Hiroshi
Matsumoto Hideya
Ohgawara Shoji
Suzuki Setsu
Bowers Charles
Canon Sales Co., Inc.
Lee Hsien-Ming
Semiconductor Process Laboratory Co. Ltd.
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