Method of cleaning solder pastes from a substrate with an aqueou

Details Method of cleaning solder pastes from a substrate with an aqueou Method of cleaning solder pastes from a substrate with an aqueou

1995-04-26

1997-01-14

Warden, Jill

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

134 2, 134 40, 134 42, 510175, 510245, 510254, 510255, 510420, 510421, B08B 304, B08B 312

Patent

active

055935044

ABSTRACT:
Printing applicators such as metal stencils and screens used to apply solder paste to printed circuit boards are cleaned to remove accumulated solder paste therefrom by an aqueous alkaline salt cleaner. The aqueous cleaner of the present invention comprises alkaline salts such as alkali metal carbonates, a surfactant formulation which contains at least one nonionic surfactant, an alkali metal silicate corrosion inhibitor and stabilizers to maintain the components in aqueous solution. The cleaner of the present invention contains no VOCs and is an effective and safe replacement for alcohol solvents previously used to clean solder paste from screens and stencils.

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"Metal Mask Stencils for Ultra Fine Pitch Printing", Surface Mount International Conference & Exposition Proceedings of the Technical Program, vol. I, M. D. Herbst , San Jose, CA, Aug. 29-Sep. 2, 1993, pp. 101-108.

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