Method of cleaning semiconductor wafers using mixer containing a

Details Method of cleaning semiconductor wafers using mixer containing a Method of cleaning semiconductor wafers using mixer containing a

1992-01-24

1993-11-16

Morris, Theodore

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

134 3, 134 26, 134 31, 134 36, B08B 308, C23G 102

Patent

active

052619664

ABSTRACT:
For cleaning semiconductor wafers in a cleaning vessel by supplying a cleaning fluid through a supply line thereto, a mixer is provided. Deionized water is supplied to the mixer through a deionized water supply line, and a cleaning gas is supplied thereto from a gas reservoir to produce the cleaning fluid. After treating the semiconductor wafers with the cleaning fluid, the deionized water is supplied to the cleaning vessel to rinse them.

REFERENCES:
patent: 4552783 (1985-11-01), Stoll et al.
patent: 4673443 (1987-06-01), Fetty
patent: 4778532 (1988-10-01), McConnell et al.
Patent Abstracts of Japan, vol. 14, No. 425 (E-977) Sep. 1990 & JP-A-2 164 035 (NEC Corp) Jun. 25, 1990.

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