Method of cleaning semiconductor wafers

Details Method of cleaning semiconductor wafers Method of cleaning semiconductor wafers

1995-10-18

1997-05-06

Breneman, R. Bruce

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

216 88, 438691, 438753, B08B 308

Patent

active

056266812

ABSTRACT:
An improved semiconductor wafer cleaning method capable of cleaning wafers without degrading the surface roughness of the wafers includes the steps of cleaning a polished wafer with an aqueous solution of hydrofluoric acid, then rinsing the wafer with ozone-containing water, and thereafter brush-scrubbing the wafer.

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Patent Abstracts of Japan, vol. 12 No. 49, Feb. 13, 1988; & JP-A-62 198127 (Sanyo Electric) Sep. 1, 1987.
Patent Abstracts of Japan, vol. 18, No. 403, Jul. 27, 1994; & JP-A-06 120192 (Sumitomo) Apr. 28, 1994.
International Conference of Solid State Devices and Materials, Aug. 26-28, 1992, Tokyo, Japan, pp. 193-195, Isagawa et al. "Ultra Clean Surface Preparation Using Ozonized Ultrapure Water".

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