Method of cleaning semiconductor wafer and computer disks by pur

Cleaning and liquid contact with solids – Processes – Including application of electrical radiant or wave energy...

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Details

134 10, 134 26, 210748, B08B 304, C02F 148

Patent

active

051835126

ABSTRACT:
Described is a process for utilizing an electric AC signal of a frequency preferably between 0.1 kHz and 1 GHz to modify and otherwise enhance the properties of deionized water used for the purpose of cleaning semiconductor wafers and computer storage disks before, during and after processing. Such treatment of the cleaning water enhances its ability to remove process chemicals, remove particulates, and otherwise improve the speed and economy of the cleaning process thereby directly improving the final yield of the chip or disk making process.

REFERENCES:
patent: 4027686 (1977-06-01), Shortes et al.
patent: 4156619 (1979-05-01), Griesshammer
patent: 4865748 (1989-09-01), Morse
patent: 4917782 (1990-04-01), Davies
patent: 4963268 (1990-10-01), Morse
patent: 4997490 (1991-03-01), Vetter et al.
patent: 5089145 (1992-02-01), Fern

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