Method of cleaning brushes used in post CMP semiconductor wafer

Details Method of cleaning brushes used in post CMP semiconductor wafer Method of cleaning brushes used in post CMP semiconductor wafer

1995-06-07

1997-06-17

Warden, Jill

Cleaning and liquid contact with solids

Processes

Using solid work treating agents

134 33, 134 38, 15 1, 15 77, 15 883, B08B 308

Patent

active

056393113

ABSTRACT:
A method of cleaning brushes used in post chemical-mechanical polishing of semiconductor wafers employs water blanks treated with a hydrofluoric acid to render the surface hydrophobic. When an undesirable amount of cleaning residue builds up brushes, the treated wafer blanks are passed between brushes to attract and remove the residue.

REFERENCES:
patent: 5078801 (1992-01-01), Malik
patent: 5122195 (1992-06-01), Hoffman
patent: 5144711 (1992-09-01), Gill, Jr.
patent: 5167667 (1992-12-01), Prigge et al.
patent: 5320706 (1994-06-01), Blackwell
patent: 5384931 (1995-01-01), Hanson
IBM Technical Disclosure Bulletin, vol. 20, No. 3, Aug. 1977, "Steam and Water Spray Wafer Cleaning", Deighton.
IBM Technical Disclosure Bulletin, vol. 26, No. 10A, Mar. 1984, "Non-Contact Semiconductor Wafer Cleaning", Holley.
"PVA Clean Sponge Material", Rippey Corporation.
"DSS-200 Series I", OnTrak Systems, Inc.

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