Method of cleaning and rinsing wafers

Details Method of cleaning and rinsing wafers Method of cleaning and rinsing wafers

1990-08-02

1991-03-05

Pal, Asok

Cleaning and liquid contact with solids

Processes

Using sequentially applied treating agents

134 34, 134 95, B08B 304, B08B 308

Patent

active

049974904

ABSTRACT:
A method for cleaning and rinsing wafers used in the production of integrated circuits is disclosed. The wafers are submerged in a tank containing deionized water and the method includes repeated cycles comprising the steps of (1) introducing deionized water into the filled tank for a preset period of time to create an upward flow of water in the tank and about the wafers, with the outflow of water flowing over the top edges of the tank, (2) partially draining the tank to a level just above the upper edges of the wafers, and (3) refilling the tank with fresh deionized water. The number of cycles can be repeated a preset number of times or the quality of the water in the tank can be monitored, with the cycles being repeated until a preset quality of water is achieved in the tank.

REFERENCES:
patent: 4375992 (1983-03-01), Stevens et al.
patent: 4917123 (1990-04-01), McConnell et al.

Affiliated with

Also associated with

Rating

Method of cleaning and rinsing wafers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of cleaning and rinsing wafers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of cleaning and rinsing wafers will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-494346