Method of cleaning a semiconductor wafer

Details Method of cleaning a semiconductor wafer Method of cleaning a semiconductor wafer

1992-07-27

1993-08-03

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

Electrostatic field or electrical discharge

C25F 100

Patent

active

052325636

ABSTRACT:
A method of removing contaminants (16) from a semiconductor wafer (10) includes placing the semiconductor wafer (10) into an ionic solution (19). A plurality of bubbles (24) are created along the surface of the semiconductor wafer (10). The bubbles (24) lift the contaminants (16) from the wafer (10) thereby floating the contaminants (16) off the wafer (10) and producing a clean wafer (10). Since the bubbles (24) form along the surface of the wafer's (10) recesses (14), contaminants (16) within the recess (14) are removed. The bubbles facilitate removing both organic and inorganic contaminants (16).

REFERENCES:
patent: 3042593 (1962-07-01), Michlin
patent: 4264418 (1981-04-01), Wood
Juan Bardina, "Methods for Surface Particle Removal: A Comparative Study", Particulate Science and Technology, pp. 6:121-131, 1988.

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