Method of cleaning a film-forming apparatus

Cleaning and liquid contact with solids – Processes – For metallic – siliceous – or calcareous basework – including...

Reexamination Certificate

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C134S019000, C134S022100, C134S036000

Reexamination Certificate

active

07942974

ABSTRACT:
A method of cleaning a film-forming apparatus to remove a silicon-based material deposited on a constituent member of the film-forming apparatus after being used to form thin films includes introducing a first gas including fluorine gas and a second gas including carbon monoxide gas into the film-forming apparatus, and heating the constituent member. The constituent member includes quartz or silicon carbide and the silicon-based material includes silicon nitride, or the constituent member includes silicon carbide and the silicon-based material includes silicon oxide.

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patent: 6554909 (2003-04-01), Haerle et al.
patent: 2003/0047445 (2003-03-01), Tojo et al.
patent: 2004/0182423 (2004-09-01), Nakao
patent: 2005/0082002 (2005-04-01), Sato et al.
patent: 3014368 (1999-12-01), None
patent: 2001-267241 (2001-09-01), None
patent: 2002100618 (2002-04-01), None
patent: 2002-158181 (2002-05-01), None
patent: 2002-184765 (2002-06-01), None
patent: 2003-59915 (2003-02-01), None
patent: 2003-178986 (2003-06-01), None
Machine Translation of JP 2002-100618 A by Ono et al., Japanese Patent Application Publication, Apr. 2002.
Computer Translation of JP 2003-178986 by Ono et al., published Jun. 27, 2003.

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