Method of clamping electrical contacts for laser bonding

Details Method of clamping electrical contacts for laser bonding Method of clamping electrical contacts for laser bonding

1989-08-21

1990-12-18

Albritton, C. L.

Electric heating

Metal heating

By arc

219 8513, B23K 2600

Patent

active

049788353

ABSTRACT:
A method of bonding a first plurality of electrical contacts to a second plurality of electrical contacts by aligning the first and second contacts, placing a diaphragm member against the first contacts and applying a differential pressure, such as a vacuum, to the diaphragm in a direction to pull the first contact toward the second contact. Thereafter, the first contacts are bonded to the second contacts with a laser. The diaphragm or a coating on the diaphragm can be a material that absorbs energy from the laser to transfer laser energy to the bond. The diaphragm may be a glass plate or a transparent membrane, may have a support bonded to the first contacts, and may include openings through which the contacts are bonded.

REFERENCES:
patent: 3485996 (1969-12-01), Chiou et al.
patent: 3570055 (1970-07-01), Jannett
patent: 4320281 (1982-03-01), Cruickshank et al.
patent: 4341942 (1982-07-01), Chaudhari et al.
patent: 4404453 (1983-09-01), Gotman
patent: 4547652 (1985-10-01), Raisig et al.
patent: 4700044 (1987-10-01), Hokanson et al.
patent: 4785156 (1988-11-01), Benko et al.
Frausto et al., "Method of Bonding an Electrically Conductive Material to an Electrically Conductive Layer Which Overlies a Curved Non-Metallic Substrate." U.S. Statutory Registration No. H158.

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