Method of chucking semiconductor wafers

Details Method of chucking semiconductor wafers Method of chucking semiconductor wafers

1992-10-26

1994-08-09

Lavinder, Jack

Abrasive tool making process, material, or composition

Impregnating or coating an abrasive tool

51235, B24B 722

Patent

active

053354575

ABSTRACT:
A method of chucking semiconductor wafers, in which a silicone elastic layer with high flatness is formed on the surface of a hard substrate having fine through-holes for vacuum chucking. Next fine through-holes in the silicone elastic layer, are provided, each through-hole communicating with the fine through-holes of the hard substrate. Next a semi-conductor wafer is held on the hard substrate by vacuum chucking from the back side of the substrate, so as to hold the semiconductor wafer securely on the substrate only by surface adhesion of the silicone elastic layer during polishing of the wafer. This method does not require wax or similar adhesive for holding the semiconductor wafer on the hard surface during the polishing process, and can realize a high-precision and high-quality surface polishing process for the semiconductor wafers.

REFERENCES:
patent: 2317348 (1943-04-01), Wekeman
patent: 2877607 (1959-03-01), Haracz
patent: 3004766 (1961-10-01), Bryant
patent: 3131476 (1964-05-01), Seher
patent: 3809050 (1974-05-01), Chough et al.
patent: 4521995 (1985-06-01), Sekiya
Patent Abstracts of Japan, vol. 11 No. 320 (E-550) (2767) Oct. 17, 1987.
Patent Abstracts of Japan, vol. 12, No. 190 (M-704) (3037) Jun. 3, 1988.

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