Abrasive tool making process – material – or composition – Impregnating or coating an abrasive tool
Patent
1992-10-26
1994-08-09
Lavinder, Jack
Abrasive tool making process, material, or composition
Impregnating or coating an abrasive tool
51235, B24B 722
Patent
active
053354575
ABSTRACT:
A method of chucking semiconductor wafers, in which a silicone elastic layer with high flatness is formed on the surface of a hard substrate having fine through-holes for vacuum chucking. Next fine through-holes in the silicone elastic layer, are provided, each through-hole communicating with the fine through-holes of the hard substrate. Next a semi-conductor wafer is held on the hard substrate by vacuum chucking from the back side of the substrate, so as to hold the semiconductor wafer securely on the substrate only by surface adhesion of the silicone elastic layer during polishing of the wafer. This method does not require wax or similar adhesive for holding the semiconductor wafer on the hard surface during the polishing process, and can realize a high-precision and high-quality surface polishing process for the semiconductor wafers.
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patent: 3809050 (1974-05-01), Chough et al.
patent: 4521995 (1985-06-01), Sekiya
Patent Abstracts of Japan, vol. 11 No. 320 (E-550) (2767) Oct. 17, 1987.
Patent Abstracts of Japan, vol. 12, No. 190 (M-704) (3037) Jun. 3, 1988.
Hashimoto Hiromasa
Matsuda Akira
Shimamoto Noboru
Shudo Shigeki
Suzuki Fumio
Lavinder Jack
Shin-Etsu Handotai & Co., Ltd.
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