Method of chemically polishing copper and copper alloy

Details Method of chemically polishing copper and copper alloy Method of chemically polishing copper and copper alloy

1973-11-26

1976-04-06

Drummond, Douglas J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

252 794, C09K 1306

Patent

active

039487032

ABSTRACT:
This invention provides a method of chemically polishing copper and copper alloys which comprises using a solution with one or more members selected from azoles having the structure represented by the general formulae ##SPC1##
Wherein X, X' and X" represent any of hydrogen, amino, aminoalkyl containing 1-3 carbon atoms and alkyl containing 1-3 carbon atoms added to an acid aqueous solution of hydrogen peroxide containing hydrogen peroxide and sulfuric or nitric acid.

REFERENCES:
patent: 2849297 (1958-08-01), Wisken
patent: 3293093 (1966-12-01), Jones et al.
patent: 3412032 (1968-11-01), Jenks
patent: 3770530 (1973-11-01), Fujimoto et al.
patent: 3773577 (1973-11-01), Shibasaki et al.
patent: 3809588 (1974-05-01), Zeblisky

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