Method of chemically bonding aluminum to carbon substrates via m

Details Method of chemically bonding aluminum to carbon substrates via m Method of chemically bonding aluminum to carbon substrates via m

1976-06-18

1978-08-01

Smith, Ronald H.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427113, 427399, 427404, 427419R, 427432, 428408, 428539, B05D 306

Patent

active

041044177

ABSTRACT:
An aluminum coated carbon article or composite, and process therefor having aluminum chemically bonded to carbon via an interface of a metal monocarbide formed in situ when an intermetallic phase comprising aluminum and a metal capable of reacting with carbon to form a metal carbide is reduced by carbon to aluminum and a metal carbide, the metal selected from the group consisting of tantalum, titanium and hafnium.

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patent: 3348967 (1967-10-01), Hucke
patent: 3419415 (1968-12-01), Dittrich
patent: 3432336 (1969-03-01), Langrod et al.
patent: 3493423 (1970-02-01), Hardwig

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