Method of chemical mechanical polishing

Details Method of chemical mechanical polishing Method of chemical mechanical polishing

2006-05-23

2006-05-23

Eley, Timothy V. (Department: 3724)

Abrading

Abrading process

Utilizing fluent abradant

C451S041000, C451S057000, C451S059000, C451S060000

Reexamination Certificate

active

07048612

ABSTRACT:
A method of chemical mechanical polishing that polishes a substrate by abrading a target material formed on the substrate with a polishing pad containing a slurry includes setting a polishing end time, at which time a predetermined thickness of the target material will have been removed from the substrate by polishing, polishing the substrate to remove the predetermined thickness of the target material, and increasing a level of byproduct contamination in the polishing pad to decrease a polishing rate, while polishing the substrate, so that the polishing rate decreases to approximately zero at the polishing end time.

REFERENCES:
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patent: 6866559 (2005-03-01), Lehman et al.
patent: 6942546 (2005-09-01), Desai et al.
patent: 2001-044158 (2001-02-01), None
patent: 2002-075939 (2002-03-01), None
patent: 1996-0035865 (1996-10-01), None
patent: 2001-0057477 (2001-07-01), None

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