Method of checking external shape of solder portion

Details Method of checking external shape of solder portion Method of checking external shape of solder portion

1990-12-07

1993-04-27

Rosenberger, Richard A.

Optics: measuring and testing

By polarized light examination

With light attenuation

356377, 356237, G01B 1124, G01N 2100

Patent

active

052067050

ABSTRACT:
The upper-limit height of a solder portion based on the thickness of a lead or a chip is set, and the maximum height of the solder portion measured with a laser beam is compared with the set upper-limit height, thereby to judge the acceptance or rejection of the shape of the solder portion. In addition, the lower-limit height of a solder portion based on the thickness of a lead or a chip is set, and the maximum height of the solder portion measured with a laser beam is compared with the set lower-limit height, thereby to judge the acceptance or rejection of the shape of the solder portion. Besides, the lower-limit wetting angle of a solder fillet is set, and the wetting angle of the solder fillet measured with a laser beam is compared with the set lower-limit wetting angle, thereby to judge the acceptance or rejection of the shape of the solder fillet.

REFERENCES:
patent: 4343553 (1982-08-01), Nakagawa et al.
patent: 4650333 (1987-03-01), Crabb et al.
patent: 4674869 (1987-06-01), Pryor et al.
patent: 4911550 (1990-03-01), Hisakuni
patent: 4988202 (1991-01-01), Nagar et al.
patent: 5011960 (1991-04-01), Ando et al.
patent: 5064291 (1991-11-01), Reiser
Park, et al., "A Solder Joint Inspection System for Automated Printed Circuit Board Manufacturing," IEEE International Conference on Robotics and Automation, pp. 1290-1295, May 1990.

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