Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Patent
1995-12-22
1999-08-17
Graybill, David E.
Semiconductor device manufacturing: process
With measuring or testing
Packaging or treatment of packaged semiconductor
438 18, 438108, 438109, 438119, 438614, 438615, H01L 2166, H05K 334
Patent
active
059406798
ABSTRACT:
Conductive adhesive for checking electric circuits is formed on contact electrodes of a chip package or a multi-chip module. After contact electrodes of the chip package or the multi-chip module are set on terminal electrodes of a checking device in a correct position, the chip package or the multi-chip module is mounted on the checking device, so that the contact electrodes are electrically connected to the terminal electrodes with the conductive adhesive in-between, and thus the electric circuits of the chip package or the multi-chip module are checked.
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Jul. 22, 1998 Communication from European Patent Office and attached Search Report.
Bessho Yoshihiro
Nakamura Yoshifumi
Tomura Yoshihiro
Graybill David E.
Matsushita Electric - Industrial Co., Ltd.
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